The National Engineering Research Center of Electronic Circuits Base Materials (hereinafter referred to as the “Center”) was approved by the Ministry of Science and Technology, established in December 2011. It is the engineering technology research center of China's electronic circuit base material industry, and Shengyi Technology Co., Ltd. is the supporting Organization.

The Center is oriented to the entire electronic circuit base material industry as well as the key, fundamental and common technical challenges in the development of upstream and downstream related industries. Through independent R&D, production integration, procedural optimization the Center conducts systematic, engineering research to promote the transfer and dissemination of scientific and technological achievements, with the goal being continuous innovation and rapid development of advanced technologies in the electronic circuit base material industry.

In recent years, the Center and the supporting Organization Shengyi Technology Co., Ltd.has undertaken a series of national and regional science and technology endeavors and technological innovation projects such as:

• Halogen-free Environmentally Friendly FR-4 Copper Clad Laminates and Prepreg of The Torch Program (2007)
• Research and Industrialization of Resin Coated Copper Series (RCC) Specifically for High Density Interconnect (HDI) of the Electronic Information Industry Development Fund Plan (2007)
• The Research and Development and Industrialization of High- Performance CCL for IC Package of the Science and Technology Support Program (2007)
• Development and Industrialization of Thin CCL Based on Domestic Ultra-fine Glass Fiber Materials (2007)
• Environmentally Friendly CCL for High Density Interconnect (HDI) Multilayer Printed Circuit Board of the National Development and Reform Commission Industrialization Project (2008)
• Test Platform Construction for High Density Packaging CCL of the Innovative Capacity Construction Special Program (2013)