ST110G
Characteristic
l Excellent heat dissipation
l Excellent thermal and insulation reliability
l Lower Z-axis CTE
Application Area
PCB heat dissipation solution
Automotive electronics
DC/DCconverter and etc.
- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Thermal Conductivity | ASTM-D5470 | A | W/ (m?K) | 1.0 |
| Tg | 2.4.25D | DMA | ℃ | 175 |
|
Td |
2.4.24.6 | Wt 5% loss | ℃ | 400 |
| Thermal Stress | 2.4.13.1 | 288℃, solder float | s | 300 |
| T288 |
2.4.24.1 |
TMA |
min |
60 |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 27 |
| After Tg | ppm/℃ | 176 | ||
| 50-260℃ | % | 1.8 | ||
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ/cm | 1.4x109 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ |
1.5x107 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | >45 |
| Peel Strength (1oz HTE) | 2.4.8 | 288℃/10s | N/mm | 1.15 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
| Water Absorption |
IPC-TM-650 2.6.2.1 |
E-1/105+D-24/23 | % | 0.10 |
Remarks:
1. All the typical value is based onthe 0.5mm specimen(5x106). The Value of water absorption andCTE(Z-axis) is based on the 2.0mm（15x2116）.
2. All the typical values listed above arefor your reference only and not intended for specification. Please contactShengyi Technology Co., Ltd. for detailed information. All rights from thisdata sheet are reserved by Shengyi Technology Co., Ltd.
3. UL certificated Single/Double sidePCB min. thickness 0.38mm.
Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning
The first digit following the letterindicates the duration of preconditioning in hours, the second digit thepreconditioning temperature in ℃ and the third digit the relativehumidity.