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CN/EN

產(chǎn)品與市場

SP168GN

特點

●  優(yōu)異的機(jī)械加工性,適合壓合工藝。

●  極小流膠,可撓曲加工極少碎屑。

●  高Tg無鹵。

應(yīng)用領(lǐng)域

適合用作散熱板、多層板及軟硬結(jié)合板粘結(jié)層
  • 產(chǎn)品性能
  • 產(chǎn)品證書
  • 資料下載
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 165
Td IPC-TM-650 2.4.24.6 5% wt. loss 380
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 70
After Tg
ppm/℃ 300
T288 IPC-TM-650 2.4.24.1 TMA min >30
Thermal Stress IPC-TM-650 2.4.24.13 288℃, solder dip -- >600S
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1GHz -- 3.85
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1GHz -- 0.013
Peel Strength IPC-TM-650 2.4.8 Copper (1/2 oz) N/mm 1.2
Copper (1 oz) N/mm 1.5
CVL N/mm 1.0
Water Absorption IPC-TM-650 2.6.2.1 E-1/105_d-2/23 % 0.14
Flammability UL94 E-24/125
Rating V-0

Remarks:

1.Specimenthickness: 0.8mm. All the typical value listed above is for your referenceonly,  please turn to Shengyi TechnologyCo., Ltd. for detailed information.

2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.